Chizhou Huayu sealing and testing ability Chizhou Huayu Electronics has mass-produced as many as 120 kinds of packaging varieties, more than 30 kinds of finished product test solutions, in 2022, the company will add three-temperature Prober: TSK UF3000EX-e automatic wafer probe station, three-temperature Handler: HT-1028C test sorting machine, 3D Vision inspection appearance inspection machine and S100, 3380, STS8200, NI STS T4, J750HD and other ATE equipment, With automotive-grade product packaging and testing capabilities, we provide our customers with diverse, fast

一元復始，萬象更新，千帆過盡，向“芯”而行，回首2022，意義非凡，展望2023，充滿希望。 1月9日上午，華宇集團2022年經(jīng)營分析暨2023年經(jīng)營計劃大會如期召開。會議設池州華宇電子主會場與深圳寶安、深圳福保、無錫、合肥四個分會場。集團董事長、各子公司負責人、高管及員工代表60余人參加了會議。會議由集團董事長彭勇主持。 會上，各子公司負責人依次對2022年的工作經(jīng)營以及2023年的發(fā)展方向做了深層次的分析與匯報，表示未來我們要更加切實的服務好現(xiàn)有客戶，緊跟市場動向，向高端市場邁進，要在汽車電子芯片上領域開疆擴土，挖掘更多優(yōu)質(zhì)客戶。 董事長彭勇就匯報內(nèi)容做了充分的肯定，并給予高度的認可。他表示過去的一年，是華宇創(chuàng)業(yè)發(fā)展以來最不平凡的一年。從年初深圳疫情爆發(fā)，到年中無錫，合肥疫情發(fā)生，再到年底池州疫情，華宇在四個城市五家工廠疫情靜默管理期間，大家以身作責，帶領職工駐廠，克服困難，為客戶趕貨，贏得客戶信任。詮釋了天道酬勤，厚德載物。 新的一年，我們要從以下方面抓高質(zhì)量發(fā)展，抓業(yè)績，抓投資，改善員工福利。 一、 以總經(jīng)理為首的全面質(zhì)量管理體系建設：利用利用系統(tǒng)和體系管理流程，推動企業(yè)高質(zhì)量發(fā)展； 二、內(nèi)控制度要再完善：從五個工廠全面實施優(yōu)化企業(yè)經(jīng)營管理制度與規(guī)范落實，讓公司經(jīng)營更順，所有工作人員輕裝上陣，責權(quán)利更清晰。 三、 大力創(chuàng)新與技術改造：提升芯片測試領域高端裝備更新，車規(guī)級芯片成品與晶圓三溫測試，12英寸大尺寸晶圓測試能力都需要大幅提升。在封裝方面LGA、QFN、LQFP高腳位，BGA、FCBGA、FANOUT工藝需要積極研發(fā)投入與人才儲備。大力對現(xiàn)有舊裝備與工藝進行技術改造，確保技術、品質(zhì)、效率符合當前市場競爭力。 四、 以質(zhì)為本，忠于客戶：2023年我們需要開拓一批優(yōu)質(zhì)客戶，市場部要圍繞高端封裝系列產(chǎn)品開展揭榜掛帥行動，以市場牽頭，觸發(fā)研發(fā)導入，生產(chǎn)規(guī)模化。 五、 供應鏈合作能力提升：維繞SCM管理體系，以QCDS為管理基本法則，重點支持優(yōu)質(zhì)供應商，重點建立戰(zhàn)略合作伙伴。 六、 員工福利提升：要始終做好引進人才，用好人才，留住人才，成就人才。完善華宇電子人力資源制度，讓公司好口碑口口相傳，每位同事做好對外形象的第一責任人。

 12月26日，“中國集成電路設計業(yè)2022年會暨廈門集成電路產(chǎn)業(yè)創(chuàng)新發(fā)展高峰論壇（ICCAD 2022）”在廈門國際會展中心拉開帷幕。   華宇電子立足半導體封測產(chǎn)業(yè)鏈，用心深耕，形成了具有華宇特色的封測產(chǎn)業(yè)鏈，展臺上吸引了眾多客戶及供應商駐足探討！ 在ICCAD 12月27日舉辦的先進封裝與測試論壇上，池州華宇電子科技股份有限公司董事長彭勇以《探索集成電路先進封裝發(fā)展新趨勢》為題做了演講，以先進封裝現(xiàn)階段的發(fā)展趨勢以及華宇電子在先進封裝領域取得的成果，華宇電子可為客戶提供一站式、多元化、就近化、一體化的封裝測試解決方案，為客戶創(chuàng)造價值。

On November 17, the 2022 World Integrated Circuit Conference, co-hosted by the Ministry of Industry and Information Technology and the People’s Government of Anhui Province, was held in Hefei, Anhui Province. Chizhou Huayu Electronic Technology Co., Ltd. appeared at booth E1-0299. This grand event, with the theme of “win-win cooperation”, released the “2022 World Integrated Circuit Conference “Hefei Initiative”, advocating that the upstream and downstream leading enterprises of the global integrated circuit industry chain jointly maintain the resilience and stability

On the morning of April 9, Governor Wang Qingxian visited Chizhou Hisemi Electronics Co., Ltd. to investigate the company’s development and safety production management. Peng Yong, chairman and general manager of Chizhou Hisemi Electronics, accompanied and reported the work during the whole process. When investigating work safety, I first reported the responsibility system structure of chizhou Hisemi Electronic work safety, and the organization and operation of the actual work safety. Governor Wang Qingxian was very pleased to know that work

On March 31, 2022, organized and hosted by The Department of Economy and Information Technology of Anhui Province and jointly promoted by the Development and Reform Commission of Anhui Province, The Department of Science and Technology of Anhui Province and the Bureau of Economic and Information Technology of Hefei, the “core” and “car” collaborative special matchmaking meeting was successfully held in Hefei Crystal Collection. Chizhou Hisemi Electronic Technology Co., LTD., as a key enterprise in the chip packaging industry in